| 000 | 01320nam^a2200313^a^4500 | ||
|---|---|---|---|
| 001 | UDM01000148538 | ||
| 003 | UDM | ||
| 005 | 20210527184838.0 | ||
| 008 | 141003s2014^^^^ohua^^^^^^^^^^000^0^eng^d | ||
| 020 | _a1627080589 | ||
| 020 | _a9781627080583 | ||
| 082 | 0 | 4 |
_a671.52 _bS684b 2014 |
| 245 | 1 | 0 |
_aSoldering : _bunderstanding the basics / _cedited by Mel Schwartz. |
| 264 | 3 | 1 |
_aMaterials Park, OH : _bASM International, _c2014. |
| 300 |
_avii, 198 páginas : _bilustraciones. |
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| 336 |
_atexto _btxt _2rdacontent |
||
| 337 |
_ano mediado _bn _2rdamedia |
||
| 338 |
_avolumen _bnc _2rdacarrier |
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| 504 | _aIncluye bibliografía. | ||
| 505 | 0 | _aPreface -- Chapter 1 Soldering - definition and differences -- Chapter 2 Solder filler materials -- Chapter 3 Lead-free solders -- Chapter 4 Fluxes -- Chapter 5 Solder pastes -- Chapter 6 Soldering processes and equipment -- Chapter 7 Soldering in electronics assemblies -- Chapter 8 Quality control, inspection, and reliability -- Chapter 9 The future of soldering -- Index. | |
| 650 | 1 | 4 |
_94472 _aSoldadura. |
| 700 | 1 |
_9276614 _aSchwartz, Mel, _eeditor. |
|
| 942 |
_2ddc _cGEN |
||
| 991 |
_aC0 _bUN@ |
||
| 991 |
_aMT _aOT14 _aPeña Parás, Laura. |
||
| 997 |
_aBHUERTA2 _b00 _c20141003 _lUDM01 _h1102 |
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| 998 |
_aMLOPEZ _b00 _c20141009 _lUDM01 _h1654 |
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| 999 |
_c136220 _d136220 |
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| 900 | _aMYM | ||