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_a1439862052 _q(hardback : acid-free paper) |
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_a621.38152 _bC518s 2012 |
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_9187438 _aChen, Andrea, _eautor |
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_aSemiconductor packaging : _bmaterials interaction and reliability / _cAndrea Chen, Randy Hsiao-Yu Lo. |
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_aBoca Raton, FL : _bCRC Press, _cc2012. |
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_axviii, 198 páginas : _bilustraciones ; _c24 cm. |
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_ano mediado _bn _2rdamedia |
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_avolumen _bnc _2rdacarrier |
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| 504 | _aIncluye bibliografía. | ||
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_9320687 _aEncapsulado microelectrónico. |
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_9237660 _aLo, Randy. _eautor |
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_aBC Materiales y Tecnologías de Empaque _aPR15 |
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_aDI _aOT13 _aOrtiz Silva Patricio. |
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