Imagen de portada de Amazon
Imagen de Amazon.com

Microelectronic packaging / edited by M. Datta, T. Osaka, J. W. Schultze.

Colaborador(es): Tipo de material: TextoTextoSeries New trends in electrochemical technology ; v. 3Editor: Boca Raton, FL : CRC Press, c2005Descripción: 542 páginas : ilustracionesTipo de contenido:
  • texto
Tipo de medio:
  • no mediado
Tipo de soporte:
  • volumen
ISBN:
  • 041531190X
  • 9780415311908
Tema(s): Clasificación CDD:
  • 621.381046 M626 2005
Contenidos:
Electrochemical processing technologies and their impact in microelectronic packaging / Madhav Datta -- Electroplating process for Cu chip metallization / Valery M. Dubin ... [et al.] -- Electroless barrier and seed layers for on-chip metallization / Valery M. Dubin ... [et al.] -- Alternative materials for ULSI and MEMS metallization / Yosi Shacham-Diamond ... [et al.] -- Tape carrier and development trend / Osamu Yoshioka and Akira Chinda -- Flip-chip interconnection / Madhav Datta -- Compliant interconnects / Paul A. Kohl -- Pb-free flip-chip technologies / Darrel R. Frear and W.H. Lytle -- Materials overview in organic packaging / Saikumar Jayaraman, John Tang, and Vijay S. Wakharkar -- Glass-ceramic packages / Kazuhiro Ikuina, Yuzo Shimada, and Kazuaki Utsumi -- Electrochemical processes in the fabrication of multichip modules / Sol Krongelb ... [et al.] -- Bumping technology for advanced packages / Shinichi Wakabayashi -- Plated through-hole technology for boards / Haruo Akahoshi -- Electroplated contact materials for connectors and relays / Yutaka Okinaka -- Chemical-mechanical planarization : from scratch to planar / David K. Watts, Norio Kimura, and Manabu Tsujimura -- Electrochemical deposition equipment / Tom Ritzdorf and Dakin Fulton -- Processes and equipment for wet etching and cleaning / Jeffery W. Butterbaugh.
Etiquetas de esta biblioteca: No hay etiquetas de esta biblioteca para este título. Ingresar para agregar etiquetas.
Valoración
    Valoración media: 0.0 (0 votos)
Existencias
Tipo de ítem Biblioteca actual Colección Signatura topográfica Estado Notas Fecha de vencimiento Código de barras Reserva de ítems
Libro Biblioteca Central Colección General 621.381046 M626 2005 (Navegar estantería(Abre debajo)) Disponible GEN 33409002403990
Total de reservas: 0

Incluye bibliografía.

Electrochemical processing technologies and their impact in microelectronic packaging / Madhav Datta -- Electroplating process for Cu chip metallization / Valery M. Dubin ... [et al.] -- Electroless barrier and seed layers for on-chip metallization / Valery M. Dubin ... [et al.] -- Alternative materials for ULSI and MEMS metallization / Yosi Shacham-Diamond ... [et al.] -- Tape carrier and development trend / Osamu Yoshioka and Akira Chinda -- Flip-chip interconnection / Madhav Datta -- Compliant interconnects / Paul A. Kohl -- Pb-free flip-chip technologies / Darrel R. Frear and W.H. Lytle -- Materials overview in organic packaging / Saikumar Jayaraman, John Tang, and Vijay S. Wakharkar -- Glass-ceramic packages / Kazuhiro Ikuina, Yuzo Shimada, and Kazuaki Utsumi -- Electrochemical processes in the fabrication of multichip modules / Sol Krongelb ... [et al.] -- Bumping technology for advanced packages / Shinichi Wakabayashi -- Plated through-hole technology for boards / Haruo Akahoshi -- Electroplated contact materials for connectors and relays / Yutaka Okinaka -- Chemical-mechanical planarization : from scratch to planar / David K. Watts, Norio Kimura, and Manabu Tsujimura -- Electrochemical deposition equipment / Tom Ritzdorf and Dakin Fulton -- Processes and equipment for wet etching and cleaning / Jeffery W. Butterbaugh.

No hay comentarios en este titulo.

para colocar un comentario.

Con tecnología Koha